New PlayStation 5 patent suggests its using liquid metal cooling paste. Whatever the fuck it takes, dudes!

ps5 liquid metal cooling paste

Apparently, according to a patent, the PlayStation 5 is using an “Eutectic Liquid Metal type paste, which should improve the heat transfer from the previously used thermal paste” (Fisher). Whatever the fuck that means! I genuinely don’t know. All I know? Is that when I’m playing Ghost of Tsushima, my PS5 sounds like an airplane and runs hotter than fucking balls. So, let’s hope this works!

Comic Book:

A new PS5 patent has revealed that Sony will not be making one of PS4’s biggest mistakes again with its next-gen PlayStation console. If you own a PS4, you will know it overheats all the time. It’s said a lot so it’s a bit trite, but it’s still true: it sounds like a jet is taking off in your room when the PS4 gets chugging running the most technically demanding games like Red Dead Redemption 2 and The Last of Us Part 2. And this comes down to poor heating transfer and a shoddy cooling system.

Earlier this year, we heard Sony was reportedly spending big on its cooling system to ensure this isn’t a problem on PS5. And this may also be why the PS5 is so big. The PS4 is compact and sleek, but that comes at a cost.

That said, adding to this report is a new patent that suggests the PS5 isn’t skimping out in this department like its predecessor did. As Gaming Route notes, the patent seemingly confirms the PS5 will make use of a Eutectic Liquid Metal type paste, which should improve the heat transfer from the previously used thermal paste.

“The present invention provides a structure in which a metal having fluidity is utilized as a heat conductive material,” reads an abstract of the patent. “In this structure, a heat conductive material is prevented from invading an unintended region even when a positional change of a semiconductor device occurs or a vibration occurs. This electronic apparatus has a heat conductive material formed between a heat radiator and a semiconductor chip. The heat conductive material has fluidity at least when the semiconductor chip is in operation. The heat conductive material has electroconductivity. The heat conductive material is surrounded by a seal member. A capacitor is covered by an insulating section.”